Power chips are attached to exterior circuits via packaging, and their performance depends upon the assistance of the product packaging. In high-power situations, power chips are typically packaged as power components. Chip affiliation refers to the electric connection on the top surface of the chip, which is generally aluminum bonding cable in typical modules. ^
Typical power component plan cross-section
Today, industrial silicon carbide power modules still primarily utilize the product packaging innovation of this wire-bonded traditional silicon IGBT module. They deal with issues such as large high-frequency parasitic specifications, not enough heat dissipation capability, low-temperature resistance, and not enough insulation toughness, which limit using silicon carbide semiconductors. The display screen of superb efficiency. In order to solve these problems and fully make use of the massive potential advantages of silicon carbide chips, several brand-new packaging technologies and services for silicon carbide power components have emerged in the last few years.
Silicon carbide power module bonding method
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have actually created from gold wire bonding in 2001 to light weight aluminum cable (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have actually created from gold cables to copper wires, and the driving force is cost decrease; high-power tools have created from light weight aluminum cords (strips) to Cu Clips, and the driving force is to improve product performance. The higher the power, the greater the needs.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that uses a solid copper bridge soldered to solder to link chips and pins. Compared with traditional bonding product packaging methods, Cu Clip technology has the adhering to benefits:
1. The connection in between the chip and the pins is made from copper sheets, which, to a certain level, changes the common cord bonding technique between the chip and the pins. Consequently, a special plan resistance worth, greater existing circulation, and better thermal conductivity can be obtained.
2. The lead pin welding location does not require to be silver-plated, which can totally save the price of silver plating and bad silver plating.
3. The item appearance is entirely consistent with typical products and is mainly used in web servers, mobile computers, batteries/drives, graphics cards, electric motors, power materials, and other areas.
Cu Clip has 2 bonding approaches.
All copper sheet bonding approach
Both the Gate pad and the Resource pad are clip-based. This bonding technique is a lot more pricey and complicated, however it can accomplish much better Rdson and better thermal impacts.
( copper strip)
Copper sheet plus cord bonding method
The source pad makes use of a Clip approach, and eviction utilizes a Cable approach. This bonding approach is a little cheaper than the all-copper bonding method, saving wafer area (appropriate to extremely small gate locations). The procedure is simpler than the all-copper bonding method and can obtain better Rdson and much better thermal effect.
Provider of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper types, please feel free to contact us and send an inquiry.
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